3D IC Integration and Packaging

by: John H. Lau

  • Publisher: McGraw-Hill Education (Professional)

  • Print ISBN: 9780071848060, 0071848061

  • eText ISBN: 9780071848077, 007184807X

  • Edition: 1st
  • Copyright year: 2015

3D IC Integration and Packaging 1st Edition by John H. Lau and Publisher McGraw-Hill Education (Professional). Save up to 80% by choosing the eTextbook option for ISBN: 9780071848077, 007184807X. The print version of this textbook is ISBN: 9780071848060, 0071848061.