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3D IC Integration and Packaging
by
John H. Lau
Publisher:
McGraw-Hill Education
Print ISBN:
9780071848060, 0071848061
eText ISBN:
9780071848077, 007184807X
Edition:
1st
Copyright year:
2015
3D IC Integration and Packaging 1st Edition by John H. Lau and Publisher McGraw-Hill Education. Save up to 80% by choosing the eTextbook option for ISBN: 9780071848077, 007184807X. The print version of this textbook is ISBN: 9780071848060, 0071848061.