Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

by: Xing-Chang Wei

  • Publisher: CRC Press
  • Print ISBN: 9781138033566, 1138033561

  • eText ISBN: 9781315305851, 1315305852

  • Edition: 1st
  • Copyright year: 2017
Available from $ 75.34 CAD
SKU: 9781315305851