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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Cover image: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect 9789811061646
  • Author(s)
    Jie Cheng
  • Publisher
    Springer
  • Format
    Fixed Layout
  • Print ISBN 9789811061646, 9811061645
  • eText ISBN 9789811061653, 9811061653
  • Copyright
    2018
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect is written by Jie Cheng and published by Springer. The Digital and eTextbook ISBNs for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect are 9789811061653, 9811061653 and the print ISBNs are 9789811061646, 9811061645. Save up to 80% versus print by going digital with VitalSource.

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