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Cover image: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging 1st edition 9780387279749

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

1st Edition

  • Author(s) Ephraim Suhir; ‎Y.C. Lee; ‎C.P. Wong
  • Publisher Published by Springer Copyright © 2007
  • "ISBN-13 9780387279749"
  • Format Fixed Layout

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging 1st Edition is written by Ephraim Suhir; ‎Y.C. Lee; ‎C.P. Wong and published by Springer. The Digital and eTextbook ISBNs for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging are 9780387329895, 0387329897 and the print ISBNs are 9780387279749, 0387279741. Save up to 80% versus print by going digital with VitalSource.

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