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Cover image: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 9783319023779

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

  • Author(s) Brandon Noia; Krishnendu Chakrabarty
  • Publisher Published by Springer Copyright © 2014
  • "ISBN-13 9783319023779"
  • Format Reflowable Layout

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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs is written by Brandon Noia; Krishnendu Chakrabarty and published by Springer. The Digital and eTextbook ISBNs for Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs are 9783319023786, 3319023780 and the print ISBNs are 9783319023779, 3319023772. Save up to 80% versus print by going digital with VitalSource.

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