• Education & Business Solutions Opens in new window
Cover image: 3D IC Integration and Packaging 1st edition 9780071848060

3D IC Integration and Packaging

1st Edition

  • Author(s) John H. Lau
  • Publisher Published by McGraw-Hill Copyright © 2015
  • "ISBN-13 9780071848060"
  • Format Reflowable Layout

eBook

eTextbook License
‌
R3,648.77 ZAR
‌
‌

  • Study Tools

    Built-in study tools like highlights and more

  • Read Aloud

    Listen and follow along as Bookshelf reads to you

  • Offline Access

    Access your eTextbook anytime and anywhere

  • Global Search

    Search across book content, figures, and your workbook

Learn More

3D IC Integration and Packaging 1st Edition is written by John H. Lau and published by McGraw-Hill. The Digital and eTextbook ISBNs for 3D IC Integration and Packaging are 9780071848077, 007184807X and the print ISBNs are 9780071848060, 0071848061. Save up to 80% versus print by going digital with VitalSource.

Back to Top