• Education & Business Solutions Opens in new window
Cover image: Wire Bonding in Microelectronics 3rd edition 9780071476232

Wire Bonding in Microelectronics

3rd Edition

  • Author(s) George Harman
  • Publisher Published by McGraw-Hill Copyright © 2009
  • "ISBN-13 9780071476232"
  • Format Reflowable Layout

eBook

eTextbook License
‌
R1,991.75 ZAR
‌
‌

  • Study Tools

    Built-in study tools like highlights and more

  • Read Aloud

    Listen and follow along as Bookshelf reads to you

  • Offline Access

    Access your eTextbook anytime and anywhere

  • Global Search

    Search across book content, figures, and your workbook

Learn More

Wire Bonding in Microelectronics 3rd Edition is written by George Harman and published by McGraw-Hill. The Digital and eTextbook ISBNs for Wire Bonding in Microelectronics are 9780071642651, 007164265X and the print ISBNs are 9780071476232, 0071476237. Save up to 80% versus print by going digital with VitalSource. Additional ISBNs for this eTextbook include 9781282504905.

Back to Top