Cover image: 3D Interconnect Architectures for Heterogeneous Technologies 9783030982287

3D Interconnect Architectures for Heterogeneous Technologies

Modeling and Optimization

  • Author(s) Lennart Bamberg; Jan Moritz Joseph; Alberto García-Ortiz; Thilo Pionteck
  • Publisher Published by Springer Copyright © 2022
  • "ISBN-13 9783030982287"
  • Format Reflowable Layout

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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization is written by Lennart Bamberg; Jan Moritz Joseph; Alberto García-Ortiz; Thilo Pionteck and published by Springer. The Digital and eTextbook ISBNs for 3D Interconnect Architectures for Heterogeneous Technologies are 9783030982294, 3030982297 and the print ISBNs are 9783030982287, 3030982289. Save up to 80% versus print by going digital with VitalSource.

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