Cover image: 3D Microelectronic Packaging 2nd edition 9789811570896

3D Microelectronic Packaging

From Architectures to Applications

2nd Edition

  • Author(s) Yan Li; Deepak Goyal
  • Publisher Published by Springer Copyright © 2021
  • "ISBN-13 9789811570896"
  • Format Reflowable Layout

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3D Microelectronic Packaging: From Architectures to Applications 2nd Edition is written by Yan Li; Deepak Goyal and published by Springer. The Digital and eTextbook ISBNs for 3D Microelectronic Packaging are 9789811570902, 9811570906 and the print ISBNs are 9789811570896, 9811570892. Save up to 80% versus print by going digital with VitalSource.

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