Cover image: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices 1st edition 9780367635886

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

1st Edition

  • Author(s) Ephraim Suhir
  • Publisher Published by CRC Press Copyright © 2021
  • "ISBN-13 9780367635886"
  • Format Reflowable Layout

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices 1st Edition is written by Ephraim Suhir and published by CRC Press. The Digital and eTextbook ISBNs for Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices are 9780429863813, 0429863810 and the print ISBNs are 9780367635886, 0367635887. Save up to 80% versus print by going digital with VitalSource. Additional ISBNs for this eTextbook include 9781138624733, 9780429460470, 9780429863806, 9780429863820.

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