Cover image: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging 9783319992556

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Materials, Processes, Equipment, and Reliability

  • Publisher Published by Springer Copyright © 2019
  • "ISBN-13 9783319992556"
  • Format Reflowable Layout

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability and published by Springer. The Digital and eTextbook ISBNs for Die-Attach Materials for High Temperature Applications in Microelectronics Packaging are 9783319992563, 3319992562 and the print ISBNs are 9783319992556, 3319992554. Save up to 80% versus print by going digital with VitalSource.

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