Cover image: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces 1st edition 9781119793779

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

High Performance Compute and System-in-Package

1st Edition

  • Author(s) Dr. Beth Keser
  • Publisher Published by Wiley-IEEE Press Copyright © 2022
  • "ISBN-13 9781119793779"
  • Format Reflowable Layout

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package 1st Edition is written by Dr. Beth Keser and published by Wiley-IEEE Press. The Digital and eTextbook ISBNs for Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces are 9781119793892, 1119793890 and the print ISBNs are 9781119793779, 1119793777. Save up to 80% versus print by going digital with VitalSource. Additional ISBNs for this eTextbook include 9781119793908.

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