Cover image: Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers 1st edition 9781569905517

Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

1st Edition

  • Author(s) Jörg Franke
  • Publisher Published by Hanser Publications Copyright © 2014
  • "ISBN-13 9781569905517"
  • Format Fixed Layout

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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers 1st Edition is written by Jörg Franke and published by Hanser Publications. The Digital and eTextbook ISBNs for Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers are 9781569905524, 1569905525 and the print ISBNs are 9781569905517, 1569905517. Save up to 80% versus print by going digital with VitalSource.

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